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Bondwire simulation for MMIC to Board Transitions
Most sweeps have been disabled in this project since they take a long time to simulate
This project simulates a bondwire interconnect from MMIC to Board bond pads using the Finite Element Engine Analyst. Reference plane for the simulations are the inside edge of the bondpads so that the interconnect can be used in a higher level MMIC simulation. The EM structure has been fully parameterized in the bond pad sizes, distance between MMIC and board, and MMIC and pedestal heights are configurable by user. The bondwire PCELL tracks these parameter changes correctly so everything stays connected. Sweeps can be used for the board and MMIC bondpads to allow users to optimize them in the circuit schematic instantiation of the interconnect EM structure.
Modeling and Simulation
The top level EM structure "Interconnect_MMIC2Board_LumpedPorts" is constructed using hierarchy with two different technology LPFs, one for the MMIC and one for the board. Parameterization is done thru the various levels and is pulled to the top. Shape modifiers are used at the various levels to set the dimensions of various interconnect parts with the EM structure being instantiated and used in the schematic "AmplifierWithInterconnect".
Interpolation of the EM structure is by default "Off". Please Right Mouse Click on EM Structure and select Options and in the Interpolation tab uncheck "Project Defaults" and check "Enable Parameter Interpolation" to allow the your sweep variables to use any value between the low and high sweep ranges.
The following plots are shown over the pedestal thickness of 0.1 to 0.5mm:
Equivalent Inductance - Displays the equivalent inductance value over frequency for the dual bondwire simulation.
Interconnect Smith - Displays the input impedance of the transition on the MMIC side.
Thru Pedestal - Displays the input impedance and thru loss of the transition by itself.
EM Structure - Interconnect_MMIC2Board_LumpedPorts
Graph - Interconnect Smith
Graph - Equivalent Inductance