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This six-part video for advanced users overviews how Microwave Office software can be used for multi-technology designs.
- Part 1 - explains the concept of multi-technology and presents an example of an SMA connector to a board to a chip.
- Part 2 - explains libraries and PDKs. How LPF files and STACKUP blocks work for a single technology are explained before getting into multiple technologies.
- Part 3 - highlights layout topics in the context of multiple technologies. The layout options mismatch warning is discussed, as well as global definitions for multiple sets of elements, and how to work with multiple LPF files. How to make a schematic for a chip and adding subcircuits in order to work with both a board and a chip are demonstrated.
- Part 4 - talks about how units are handled in multi-technology and how to set the vertical positioning in the schematic layout that has a 2D layout but can have 3D elements.
- Part 5 - addresses EM simulation for multi-technology using the Analyst™ 3D EM simulator, shows how to use the process center to make a custom PDK and STACKUP, and presents an example of creating an EM project of a two-layer board. Inserting a QFN package, PCell models, hierarchy of multiple cells in the layout, and vertical positioning of cells in layers are discussed.
- Part 6 - recaps the important points of the series. Future e-Learning videos will demonstrate how the entire structure example shown in this series was drawn.
The entire video is approximately 1 hour in length.
This video appears in the E-Learning table of contents as:
Experienced User and/or Specialized Curriculum - Multi-technology