How should I set up a GMnCLIN model with a cover?
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The GMSUB element is used to define the vertical stack of substrate layers for the electrical model of the GMnCLIN element. The key parameter is n, the number of physical layers in the stack. Once n is defined for a GMSUB element with no cover, the relative dielectric constant (Er), dielectric loss tangent (TanD), dielectric thickness (H), and conductor thickness (T) must all be defined as vector quantities. The first element in each vector defines the characteristics of the top most substrate layer, the second element defines the characteristics of the substrate layer second from the top, and so on.
If you do not want to model the effect of a cover, the lengths of the vectors for Er, TanD, H, and T will be the same as the number of layers you want to model. Also, set parameter Cover to "No Cover" as in schematic GM4CLIN_no_cover in the attached project.
An additional parameter named Cover Elevation Over Substrate (Hc) is required if you want to use a cover as in schematic GM4CLIN_cover in the attached project. This parameter is the height of the top most layer just beneath the cover. Also it is necessary to set Cover to either "Metallic Cover" or "Metallic Box" depending on your application. Finally, the number n and vector lengths of Er, TanD, H, and T will be one less than the total number of layers you want to model since the first layer in the stack is explicitly specified as Cover Elevation Over Substrate (Hc).
See Element Help for GMSUB for more information and for how to set GMnCLIN elements for other physical configurations.