<p><span class="emphasis"><em>The attached file (pdf format) contains the slides and notes for the

                                     "webinar" given by Dr. John Dunn for Applied Wave Research on November 3, 2005. The

                                     recorded webinar can be viewed by downloading: </em></span></p>

            <p><a class="link" href="http://casts.awrcorp.com/faq/english/videos/signal_integrity_modeling/signal_integrity_modeling.zip" target="_top">Download</a></p>

            <p>It is important that the behavior of the critical analog nets be accurately predicted

                           as the chip, package, and board are being designed. The designer is faced with the task

                           of a "cross-domain" modeling problem, where the interconnect must be designed in

                           different technologies concurrently. In this seminar, I show a specific example of an

                           output signal from a power amplifer going from the chip, through bondwires onto the

                           package, and then to the system board. The designer corrects for package mismatches by

                           placing a capacitor on the board. Simulations incorporate the effects of the entire

                           path. The example will be used to demonstrate layout and simulation in cross-domain

                           technologies and the proper configuration of the setup files.

            </p>

            <p><span class="bold"><strong>Summary: </strong></span> This is the final part of our three part

                           series on the inner workings of EMSight, the internal electromagnetic simulator in

                           Microwave Office. Emphasis will be placed on fundamental concepts essential for

                           successful simulations. Topics covered in the webinar are: correct use of ports of the

                           three types of ports: edge ports, via ports, and internal ports. 

            </p>